This module contains the STMicroelectronics android.hardware.thermal binary source code.

It is part of the STMicroelectronics delivery for Android.

This module implements android.hardware.thermal HIDL version 2. Please see the Android delivery release notes for more details.

• The [release notes][] provide information on the release. [release notes]: https://wiki.st.com/stm32mpu-ecosystem-v5/wiki/STM32_MPU_OpenSTDroid_release_note_-_v5.1.0

This module can't be used alone. It is part of the STMicroelectronics delivery for Android. To be able to use it the device.mk must have the following packages:

PRODUCT_PACKAGES += \
    [email protected]

This directory contains the sources and associated Android makefile to generate the thermal binary.

This module is distributed under the Apache License, Version 2.0 found in the LICENSE file.